Metal Core PCB Manufacturing Services

Multilayer Metal Core PCB

JHYPCB is a well-known MCPCB manufacturer that offers high-quality and affordable MCPCB solutions, including single-sided, double-sided, and multilayer MCPCB manufacturing service. We provide custom MCPCB fabrication and fast turnaround times.

What is Multilayer Metal Core PCB?

Multilayer metal core PCB (MCPCB) is a type of printed circuit board (PCB) that consists of multiple layers of conductive traces and insulating materials bonded together with a thermally conductive metal core. The metal core layer provides superior heat dissipation and mechanical stability compared to traditional PCBs, making it an ideal choice for applications that require high power and high thermal dissipation.

The metal core layer in MCPCBs is typically made of materials with high thermal conductivity, such as aluminum or copper, which allow heat to be dissipated quickly and efficiently from the active components on the PCB. The active layers of the PCB, which contain the conductive traces, are bonded to both sides of the metal core layer using a special bonding process. The insulation layers are then sandwiched between the active layers to create the multilayer structure.

MCPCBs are widely used in various industries such as LED lighting, automotive electronics, and power electronics. LED lighting applications, in particular, have been a driving force behind the increased demand for MCPCBs, as they require efficient heat dissipation to prevent damage to the LEDs and maintain optimal performance. Other applications of MCPCBs include power supplies, motor controllers, and audio amplifiers.

The unique combination of thermal conductivity, mechanical stability, and electrical performance offered by MCPCBs makes them a popular choice for applications that require high power and high thermal dissipation.

Composition of Multilayer Metal Core PCB

Multilayer metal core PCB (MCPCB) is composed of several layers of materials, each with a specific function in the operation of the PCB. The composition of MCPCB typically includes the following layers:

Metal core layer: The metal core layer is the foundation of the MCPCB and is typically made of thermally conductive materials such as aluminum or copper, and its thickness ranges from 0.5mm to 3.2mm. The metal core layer provides excellent heat dissipation, which is essential for high power applications. The metal core layer also provides mechanical stability to the PCB.
Dielectric layer: The dielectric layer is an insulating layer that separates the metal core layer from the conductive layers. The dielectric layer is typically made of materials with a high thermal conductivity, such as ceramic or epoxy, to facilitate heat transfer from the active components to the metal core layer. Dielectric layer thickness ranges from 0.05mm to 0.25mm.
Conductive layer: The conductive layer is the layer that contains the copper traces that form the electrical circuit of the PCB. The conductive layer is typically made of copper foil that is bonded to the dielectric layer. The copper traces are etched onto the foil using a chemical process to create the desired circuit pattern.
Solder mask layer: The solder mask layer is a protective layer that is applied to the conductive layer to prevent solder bridges and ensure proper soldering during assembly. The solder mask layer is typically made of a polymer material and is applied to the PCB using a screen-printing process.
Silkscreen layer: The silkscreen layer is a layer that contains the printed symbols and text on the PCB, such as component labels and logos. The silkscreen layer is typically applied to the PCB using a screen-printing process.

Vias in Multilayer Metal Core PCB

In addition to the layers mentioned earlier, multilayer metal core PCBs also typically contain holes that connect the various layers of the PCB. These holes are called vias.

Vias are used to create electrical connections between the different layers of the PCB. They are typically drilled through the entire PCB, from the top conductive layer to the bottom conductive layer, and then plated with metal to ensure a solid electrical connection. Vias can be classified into two types: through-hole vias and blind vias.

Through-hole vias are drilled through the entire thickness of the PCB, from the top to the bottom layer, and are used to create electrical connections between all layers of the PCB. They are typically larger in diameter than blind vias and can be filled with conductive material to further enhance the electrical connection.

Blind vias, on the other hand, are drilled partially through the PCB, connecting only some of the layers. They are typically smaller in diameter than through-hole vias and are used when space is limited on the PCB. Blind vias can be drilled from the top or bottom layer and can also be filled with conductive material.

The placement and size of vias are important design considerations for MCPCB. Vias should be placed strategically to avoid interference with other components and to optimize the electrical performance of the PCB. The size of the vias should be carefully chosen to ensure proper plating and electrical connectivity.

Advantages of Multilayer Metal Core PCB

Multilayer metal core PCB offers several advantages over traditional PCBs:

Heat dissipation: The metal core layer in MCPCB acts as a heatsink, dissipating heat from the components more efficiently than a standard PCB. This is especially important in high-power applications where heat can damage the components and reduce their lifespan.
Mechanical stability: The metal core layer provides additional rigidity to the PCB, making it more resistant to mechanical stress and vibration.
Environmental stability: MCPCB is more resistant to environmental factors such as humidity, temperature, and chemicals than traditional PCBs.
Electrical performance: The metal core layer also provides better electrical grounding and reduces electromagnetic interference (EMI) and radio-frequency interference (RFI).
Processing capability: MCPCB can be processed using standard PCB manufacturing techniques, making it easy to integrate into existing production processes.

Applications of Multilayer Metal Core PCB

Multilayer metal core PCB is used in a wide range of applications, including:

LED lighting: MCPCB is commonly used in LED lighting applications due to its excellent heat dissipation properties. It helps to extend the lifespan of the LEDs and improve their performance.
Automotive electronics: MCPCB is also used in automotive electronics such as headlights, taillights, and dashboard displays, where heat dissipation and mechanical stability are critical.
Wireless communications: MCPCB is used in wireless communication devices such as routers and base stations due to its excellent EMI and RFI shielding properties.
Industrial control: MCPCB is used in industrial control systems such as power supplies, motor drives, and automation equipment due to its high power handling capability and reliability.

Manufacturing Process of Multilayer Metal Core PCB

The manufacturing process of multilayer metal core PCB includes several steps:

Material preparation: The metal core, insulation layer, and substrate layer are prepared according to the specifications of the PCB design.
Active layer preparation: The active layers are prepared by applying a layer of photoresist to the substrate layer, exposing it to UV light through a mask, and developing it to create the desired circuit pattern.
Drilling of vias and pads: Vias and pads are drilled through the substrate layer to connect the different layers of the PCB.
Plating: The drilled holes are plated with copper to create the conductive paths between the different layers.
Lamination: The active layers and insulation layers are laminated together with the metal core layer to create the multilayer PCB.
Etching and solder mask application: The unwanted copper is etched away from the PCB using a chemical process, leaving behind the desired conductive paths. A solder mask is applied to protect the PCB and create the solderable pads.
Surface finish: The surface of the PCB is finished with a layer of metal such as gold or tin to improve solderability and prevent corrosion.

Quality Control of Multilayer Metal Core PCB

Quality control is an essential aspect of multilayer metal core PCB manufacturing to ensure that the final product meets the required specifications and standards. Some of the quality control measures used in MCPCB manufacturing include:

Visual inspection: The PCB is inspected visually for defects such as cracks, delamination, and misalignment.
Electrical testing: The PCB is tested for its electrical performance, such as impedance, continuity, and isolation.
Thermal testing: The PCB is tested for its heat dissipation properties, such as the thermal conductivity of the metal core layer.
Reliability testing: The PCB is subjected to various stress tests to evaluate its reliability under different environmental conditions, such as temperature, humidity, and vibration.