High Tg PCB Manufacturing: How It Works and What to Look for in a PCB Manufacturer
In this article, we will discuss how High Tg PCB
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High Tg PCB, or High Temperature PCB, is a type of printed circuit board that is designed to withstand high temperatures. High Tg is an abbreviation for High Glass Transition Temperature, which refers to the temperature at which the resin material used in the PCB begins to soften and lose its mechanical strength.
The glass transition temperature is a critical parameter for PCBs because it determines the maximum operating temperature of the board. High Tg PCBs have a glass transition temperature greater than 170°C, which is significantly higher than standard FR-4 PCBs, which have a Tg of around 130-140°C.
At JHYPCB, we specialize in High Tg PCBs fabrication services that offer heat resistance. Made of High Tg FR-4 substrate material, they are widely used across industries as they provide better heat resistance and mechanical and chemical stability for the printed circuit board.
FR-4 is a type of fiberglass-reinforced epoxy laminate that is widely used in PCB manufacturing. The “FR” in FR-4 stands for “Flame Retardant”, which means that it is resistant to burning when exposed to high heat or flame.
FR-4 is a composite material made of a woven fiberglass cloth and an epoxy resin binder. The fiberglass cloth provides mechanical strength and dimensional stability to the material, while the epoxy resin acts as a bonding agent to hold the fibers together and provide insulation between the conductive layers of the PCB.
FR-4 is a widely used material for PCBs due to its excellent electrical properties, good mechanical strength, low cost, and high availability. It is also a relatively easy material to work with, as it can be machined, drilled, and etched using standard PCB manufacturing processes.
FR-4 printed circuit boards are divided into 3 classifications that are determined by the number of copper trace layers found in the material:
Tg value, or Glass Transition Temperature, is a critical property of polymer materials, including those used in PCB manufacturing. It is the temperature at which the material changes from a rigid, glassy state to a soft, rubbery state.
In PCBs, Tg is an important parameter because it indicates the maximum temperature that the board can withstand during assembly and operation without losing its mechanical or electrical properties. If the temperature exceeds the Tg value, the material will soften, and the board may warp, crack, or delaminate, leading to electrical failure.
Tg values vary depending on the type of material used in the PCB. For example, standard FR-4 laminates typically have a Tg of around 130-140°C, while High Tg laminates can have Tg values greater than 170°C. Polyimide materials, which are commonly used in high-temperature applications, can have Tg values exceeding 260°C.
|Material||Tg value (°C)|
|Middle Tg FR-4||>150|
|High Tg FR-4||>170|
PCB manufacturers need to carefully select materials with appropriate Tg values based on the specific requirements of the PCB design and application. This ensures that the board can withstand the expected operating conditions and maintain its mechanical and electrical integrity over the lifespan of the product.
High Tg materials have the following properties:
High Tg PCB, or High Temperature PCB, has several advantages over standard FR-4 PCBs.
High Tg PCBs are widely used in applications where high-temperature resistance, high-reliability, and excellent electrical performance are required. Here are some specific examples of High Tg PCB applications:
High Tg PCB materials are advanced laminates that have a glass transition temperature greater than 170°C. These materials are designed to withstand higher temperatures without losing their mechanical or electrical properties.
Here are some of the most common materials used for High Tg PCBs:
Typical PCB materials for high temperature may include NP-175TL, ITEQ-IT-180A, ISOLA 370HR, Shengyi S1000-2, and many others.
The characteristics of some common High Tg PCB materials:
|Material||Glass Transition Temperature (Tg)||Dielectric Constant||Dissipation Factor||Thermal Conductivity||Applications|
|FR-4 High Tg||170-180°C||4.5-4.8||0.015-0.025||0.3-0.4 W/mK||Consumer electronics, automotive electronics, industrial automation|
|Polyimide (PI)||>260°C||3.4-4.0||0.002-0.005||0.25-0.4 W/mK||Aerospace, military and defense, high-temperature applications|
|BT Epoxy||~200°C||3.2-3.6||0.003-0.005||0.3-0.4 W/mK||Automotive electronics, aerospace, high-temperature applications|
|PTFE||>250°C||2.1-2.3||0.0005-0.002||0.25-0.4 W/mK||High-frequency applications, radar, communication systems|
|Ceramic filled materials||>170°C||4.0-6.0||0.010-0.030||1.0-4.0 W/mK||LED lighting, power electronics, high-current applications|
There are several technical options for manufacturing high-Tg (glass transition temperature) circuit boards, including:
As a PCB manufacturer, we take pride in our ability to provide high-quality and reliable high-Tg PCB manufacturing services to our customers. Here are a few reasons why you should choose us for your high-Tg PCB needs:
By choosing us for your high-Tg PCB manufacturing needs, you can have confidence that you are working with a reliable and experienced partner who is committed to delivering high-quality PCBs that meet your specific requirements. We are dedicated to providing exceptional customer service, competitive pricing, and timely delivery, and we look forward to working with you on your next project.
|Material type||FR-4 (S1141, S1000-2M), IT180, Rogers (4350B), Isola, Nelco, etc.|
|Layer count||2-64 layers|
|Board thickness||0.2-6.5 mm|
|Copper weight||0.5-6.0 oz|
|Surface finish||HASL, ENIG, OSP, Immersion Silver/Gold, etc.|
|Minimum trace width/spacing||3/3 mil|
|Minimum hole size||0.2 mm (8 mil)|
|Solder mask color||Green, red, blue, black, white, yellow, etc.|
|Silkscreen color||White, black, yellow, etc.|
|Quality standards||IPC-A-600F, MIL-PRF-31032, ISO 9001:2015, etc.|
|Testing methods||Flying probe, electrical testing, X-ray inspection, etc.|
|Lead time||3-10 days (depending on order size and complexity)|
|Material||TG (DSC, °C)||Td (Wt, °C)||CTE-z (ppm/°C)||Td260 (min)||Td288 (min)|
Ready to take your high-Tg PCB project to the next level? Contact us today to get started! Our team of experienced engineers and state-of-the-art manufacturing facilities can provide you with high-quality, reliable, and cost-effective High Tg PCB solutions that meet your unique requirements. Whether you need a small volume high Tg PCB prototype or high-volume production, we can deliver the perfect solution that meets your project’s specifications. Don’t wait any longer. Let’s discuss your project today and see how we can help you achieve success!
High Tg PCB is a type of printed circuit board made from a substrate material with a high glass transition temperature (Tg) value. This means that the material can withstand higher temperatures without losing its mechanical or electrical properties.
High Tg PCBs offer several advantages, including improved dimensional stability, better heat resistance, higher reliability, and reduced risk of delamination or failure due to temperature changes or thermal stress.
High Tg PCBs can be made from various substrate materials, such as FR-4, FR-5, Rogers, Isola, Nelco, and others. The specific material depends on the application requirements, such as temperature range, thermal cycling, mechanical stress, and cost.
High Tg PCBs are ideal for applications that require high reliability and stability under harsh environmental conditions, such as automotive, aerospace, industrial, and telecommunications industries. They are also used in high-frequency circuits, power electronics, and other applications where thermal management is critical.
The main difference between high Tg and standard PCBs is the glass transition temperature (Tg) value of the substrate material. Standard PCBs typically use materials with a Tg value of around 130-140°C, while high Tg PCBs use materials with a Tg value of 170°C or higher. This means that high Tg PCBs have better thermal stability, mechanical strength, and electrical properties at high temperatures.
When designing high Tg PCBs, several factors should be considered, such as the substrate material, layer stackup, copper weight, trace width and spacing, via size, solder mask, surface finish, and testing requirements. It is essential to choose the right material and design parameters based on the application's specific requirements and operating conditions.
High Tg PCBs are typically tested using various methods, such as electrical testing, flying probe testing, X-ray inspection, and thermal shock testing. These tests can help ensure the quality, reliability, and performance of the PCBs under different environmental conditions and stress factors.
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