JingHongYi PCB (HK) Co., Limited
Electronic PCB Board,HDI PCB,HDI Printed Circuit Board,HDI Circuit Board
What is a HDI PCB?
HDI stands for High Density Interconnector, HDI Printed Circuit Board. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad density. It is helpful in enhancing electrical performance and reduction in weight and size of the equipment. HDI PCB is the better option for high-layer count and costly laminated boards.
High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the Printed Circuit Board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.
Regarding the electrical needs of high-speed signal, the board should have various features i.e. high-frequency transmission capability, impedance control, decreases redundant radiation, etc. The board should be enhanced in the density because of the miniaturization and arrays of the electronic parts. In addition, to the result of the assembling techniques of leadless, fine pitch package and direct chip bonding, the board is even featured with exceptional high-density.
There were a lot of different names for the PCB with such structures. For example, it was called SBU (Sequence Build up the Process) in European and American industry as the program production is in the constructive mode of sequence. It was called MVP (Microvia Process) in Japanese industry because the hole of such products is much smaller than the previous one. It was also called BUM (Build up Multilayer Board) because the traditional multilayer is known as MLB (Multilayer Board).In order to avoid confusion, IPC Printed Circuit Association proposed to call it HDI (High Density Interconnection Technology) as the common name, but it can not reflect the characteristics of the circuit board. So the majority in the PCB industry define such products as HDI PCB.
Innumerable benefits are associated with HDI PCB, like high speed, small size and high frequency. It is the primary part of portable computers, personal computers, and mobile phones. Currently, HDI PCB is extensively used in other end user products i.e. as MP3 players and game consoles, etc.
HDI PCBs take advantage of the most recent technologies existing to amplify the functionality of circuit boards by means of the similar or little amounts of area. This development in board technology is motivated by the tininess of parts and semiconductor packages that assist superior characteristics in innovative new products like touch screen tabs.
HDI PCBs are described by high-density features comprising of laser micro-vias, high performance thin materials and fine lines. The better density allows extra functions per unit area. These types of multifaceted structures give the required routing resolution for large pin-count chips which are used in mobile devices and other high technology products.
The placement of the parts on the circuit board needs extra precision than conservative board design due to miniature pads and fine pitch of the circuitry on the circuit board. Leadless chips require special soldering methods and additional steps in the assembly and repair process.
The lesser weight and size of the HDI circuitry means the PCBs fit into the little spaces and have a smaller amount of mass than conservative PCB designs. The smaller weight and size even signifies that there is lesser chance of harm from mechanical shocks.
Consumer Driven Technology
The via-in-pad process supports more technology on fewer layers, proving that bigger is not always better. Since the late 1980's we have seen video cameras using cartridges the size of a novel, shrink to fit in the palm of your hand. Mobile computing and working from home pushed technology further to make computers faster and lighter, allowing the consumer to work remotely from anywhere.
HDI Technology is the leading reason for these transformations. Products do more, weigh less and are physically smaller. Specialty equipment, mini-components and thinner materials have allowed for electronics to shrink in size while expanding technology, quality and speed.
HDI PCB Types
According to layer up different, currently DHI board is divided into three basic types:
1) HDI PCB (1+N+1)
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card
1+N+1 HDI PCB Structure:
2) HDI PCB (2+N+2)
3) ELIC (Every Layer Interconnection)
JHY PCB' HDI PCB Capabilities
HDI PCB Manufacturing requires an advanced level of technical expertise and the latest state-of-the-art equipment for exacting precision.
JHY PCB offer solutions for low-volume/high-mix PCB manufacturing on a quickturn basis, as well as production quantities and high-tech capabilities for advanced builds with demanding requirements for aerospace, defense, medical, and commercial applications. Capabilities include:
| HDI |
| Type of |
| Mass |
| Small-Middle |
|1+N+1||Blind vias||Yes||Yes||Yes||4 layers+|
|2+N+2|| Blind/Buried |
|2+N+2|| Blind/Buried |
|3+N+3|| Blind/Buried |
|3+N+3|| Blind/Buried |
|Quality Grade||Standard IPC 2|
|Number of Layers||4 - 24layers|
|Order Quantity||1pc - 10000+pcs|
|Build Time||2days - 5weeks|
|Material||FR4 standard Tg 140°C,FR4 High Tg 170°C, FR4 and Rogers combined lamination|
|Board Size||Min 6*6mm | Max 457*610mm|
|Board Thickness||0.4mm - 3.0mm|
|Copper Weight (Finished)||0.5oz - 2.0oz|
|Solder Mask Sides||As per the file|
|Solder Mask Color||Green, White, Blue, Black, Red, Yellow|
|Silkscreen Sides||As per the file|
|Silkscreen Color||White, Black, Yellow|
|Surface Finish|| HASL - Hot Air Solder Leveling |
Lead Free HASL - RoHS
ENIG - Electroless Nickle/Immersion Gold - RoHS
Immersion Silver - RoHS
Immersion Tin - RoHS
OSP - Organic Solderability Preservatives - RoHS
|Min Annular Ring||4mil, 3mil - laser drill|
|Min Drilling Hole Diameter||6mil, 4mil - laser drill|
|Max Exponents of Blind/Buried Vias||stacked vias for 3 layers interconnected, staggered vias for 4 layers interconnected|
|Other Techniques|| Flex-rigid combination |
Via In Pad
Buried Capacitor (only for Prototype PCB total area ≤1m²)