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  • 8 Layer FR4 Tg170 BGA PCB Manufacturing

    8 Layer FR4 Tg170 BGA PCB Manufacturing

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    BGA Ball Grid Array A ball grid array is a type of surface mount packaging used for integrated circuits BGA packages are used to permanently mount devices such as microprocessors A BGA can provide more interconnection pins than can be put on a dual in line or flat package How to Successfully Design a BGA BGA PCB...

  • 10 Layer FR4 Tg150 BGA Multilayer PCB Manufacturing

    10 Layer FR4 Tg150 BGA Multilayer PCB Manufacturing

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    Ball Grid Array BGA aims The Ball Grid Array was developed to provide a number of benefits to IC and equipment manufacturers as well as providing benefits to the eventual users of equipment Some of the BGA benefits over other technologies include Efficient use of printed circuit board space allowing connections to be...

  • 2 Layer FR4 Tg170 1.2mm ENIG BGA PCB

    2 Layer FR4 Tg170 1.2mm ENIG BGA PCB

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    Advantages of BGA PCB Low inductance leads The shorter an electrical conductor the lower its unwanted inductance a property which causes unwanted distortion of signals in high speed electronic circuits BGAs with their very short distance between the package and the PCB have low lead inductances giving them superior...

  • 4 Layer Blind Via BGA PCB Manufacturing

    4 Layer Blind Via BGA PCB Manufacturing

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    Correct BGA partitioning first takes into account uniformity of the partitioning itself This means evenly distributing power and ground pins on the four quadrants as much as possible That is important to evenly route power and ground through the BGA geometry Fan outs should also be evenly distributed throughout the...

  • Multilayer BGA PCB Manufacturing and Assembly

    Multilayer BGA PCB Manufacturing and Assembly

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    A ball grid array BGA is a type of surface mount packaging used for integrated circuits BGA packages are used to permanently mount devices such as microprocessors A BGA can provide more interconnection pins that can be put on a dual in line or flat package each pin is provided with a solder ball All connections are...

  • BGA PCB Impedance Control

    BGA PCB Impedance Control

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    Why use BGA PCB Improve manufacturing profit based on welding improvement Most BGA package pads are large which makes large area soldering easier and more convenient As a result the manufacturing speed of PCB increased with the increase of manufacturing yield In addition when using larger pads it is easy to re work...

  • BGA PCB Via in PAD

    BGA PCB Via in PAD

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    The advantage of BGA Efficient use of PCB space Using BGA packages means fewer component involvement and smaller footprints it also helps to save space for custom PCBs which greatly increases the effectiveness of PCB space Improve thermal and electrical performance Due to the small size of PCB base on BGA package heat...

  • 6 Layer BGA PCB Board

    6 Layer BGA PCB Board

    • Brand: JHY PCB

    • Packaging: Vaccum Package

    The BGA is descended from the pin grid array PGA which is a package with one face covered or partly covered with pins in a grid pattern which in operation conduct electrical signals between the integrated circuit and the printed circuit board PCB on which it is placed In a BGA the pins are replaced by pads on the...

China BGA PCB Suppliers

Ball Grid Array (BGA), a type of surface-mount packaging (a chip carrier) used for integrated circuits.

OEM needs smaller and more diverse packaging options to meet product design challenges and maintain cost competitiveness in their respective markets. Ball grid array (BGA) packaging is becoming more and more popular to meet these design requirements. In addition, they are ideal solutions, because I/O connections are located inside the device, increasing the ratio of pins to PCB area. In addition, BGA with strong solder balls is stronger than QFP lead, so it is more robust.

Ball-Grid Array (BGA) Packages Become PCB Design Mainstream

BGA PCB Design Guidelines And Rules

BGA PCB Design Rules

At present, the standard used to accommodate various advanced and multifaceted semiconductor devices (such as FPGA and microprocessor) is encapsulated by ball grid array (BGA) devices.

In order to keep up with the technological progress of chip manufacturers, BGA software packages for embedded design have made remarkable progress in the past few years.

This special type of packaging can be decomposed into standard BGA and micro BGA.

With today's electronics technology, the demand for I/O availability poses a number of challenges, even for experienced PCB designers, due to multiple exit routes.

Correct BGA partitioning first takes into account uniformity of the partitioning, itself. Because, precise BGA partitioning on a PCB is a crucial design aspect to minimize or eliminate crosstalk and noise, as well as manufacturing issues.

Memory signals need special consideration during BGA partitioning. They need to be away from oscillating signals and power supply switching. This is important because memory signals needs to be clean. If traces carrying these signals are in the proximity of oscillating signals or switching power supply signals, they produce ripples in the memory signal traces, thereby reducing system speed. The system is operational, but at less than optimal speed levels.

BGA PCB Design Guidelines

BGA Design Strategy 1: Define an appropriate exit path

The main challenge for PCB designers is to develop appropriate exit routes without causing manufacturing failures or other problems. Several PCBs need to ensure proper fan-out wiring strategies, including pad and pass size, I/O pin number, layers required for fan-out BGA and line width spacing.

BGA Design Strategy 2: Identify the Layers Required

Another question is how many layers the PCB layout should have, which is by no means a simple decision. More layers mean higher overall cost of the product. On the other hand, sometimes you need more layers to suppress the amount of noise PCB may encounter.

Once the alignment and space width of PCB design, the size of through holes and the alignment in a single channel are determined, they can determine the number of layers they need. Best practice is to minimize the use of I/O pins to reduce the number of layers. Usually, the first two outer sides of the device do not need through holes, while the inner part needs to arrange through holes below them.

Many designers call it dog bones. It is a short path of the BGA device pad, with a through-hole at the other end. The dog bone fan comes out and divides the equipment into four parts. This allows the remaining internal padding to be accessed by another layer and provides escape paths away from the edge of the device. This process will continue until all mats are fully developed.

Partitioning a BGA into Four Sections for Easier Pad Access

Designing BGA is not easy. It requires many design rule checks (DRCs) to ensure that all traces are properly spaced and carefully studied to determine how many layers are needed to make the design successful. As technology continues to grow rapidly, so does the challenge faced by every designer, introducing design into a very narrow space.

BGA Package Types

There are six different BGA packages.

1. Moulded Array Process Ball Grid Array (MAPBGA): It is a BGA package which provides low inductance and simple surface mounting.

2. Plastic Ball Grid Array (PBGA): Again, this BGA package provides low inductance, simple surface mounting, high reliability and is cheap.

3. Thermally Enhanced Plastic Ball Grid Array (TEPBGA): Just like its name sound, this BGA package can handle great levels of heat dissipation. Its substrate has solid copper planes.

4. Tape Ball Grid Array (TBGA): You can use this BGA package as a solution for medium- to high- end applications.

5. Package on Package (PoP): It will permit you to put a memory device on some base device.

6. Micro BGA: This BGA package is quite small when compared with standard BGA packages. Currently, you will see 0.65, 0.75 and 0.8 mm pitch size dominating in the industry.

BGA PCB Assembly

Previously, Engineers were not sure whether PCB BGA assembly would be able to achieve the reliability level of traditional SMT methods. However, at present, this is no longer a problem, because BGA has been widely used in Prototype PCB assembly and mass production PCB assembly.

You will need to use reflow methods to solder a BGA package. Because only reflux method can ensure solder melting under BGA module.

We have a wealth of experience handling all types of BGAs, including DSBGA and other Complex Components, from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. We are capable of placing minimum 0.4 mm pitch BGAs on your PCB.

PCB BGA Advantages

With PCB BGA, you will get the following advantages:

1. BGA package eliminates the issue of developing small packages for ICs with lots of pins.

2. Again, when compared with packages with legs, The BGA package has a lower thermal resistance when placed on the PCB.

3. Do you know which property causes unwanted signals distortion in high-speed electronic circuits? The unwanted inductance in an electrical conductor is responsible for this phenomenon. However, BGAs have very little distance between PCB and the package which in turn leads to lower lead inductance. Thus, you will get top-class electrical performance with pinned devices.

4. With BGAs, you can effectively utilize your Printed Circuit Board space.

5. Another advantage that will come with BGA is the reduced thickness of the package.

6. Last but not least, you will get enhanced re-workability because of bigger pad sizes.


Additional Information

6 Layer BGA PCB

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