Mixed Technology PCB Assembly Services
The mixed technology PCB assembly has the properties of both surface mount technology (SMT), and through-hole technology, hence the name. Thus, these assemblies are most commonly used in the applications, which require the combination of both through-hole and SMT assemblies. This type of PCB assembly does not use any solder paste. JingHongYi PCB (HK) Co., Limited, Incis one of the most experienced and reliable manufacturers of these assemblies in China. At JHYPCB, we always strive to meet the changing assembly needs of various industries. Our mixed technology PCB assembly services are designed to provide solutions for applications where a combination of through hole and surface mount assemblies are required. We have the capability to manufacture circuit boards with single sided PCB, double sided PCB, Flexible PCB, aluminum PCB, Rigid flex PCB as well as multilayer mixed technology.
Our Mixed Technology Capabilities
We employ independent automated mixed technology assembly lines for PCBs. This allows us to provide complete PCB assemblies, and prototypes at short turnaround times.
Our customers can benefit from our following capabilities:
Mixed Technology PCB Assembly Equipment Used
State-of-the-art Automated Assembly Equipment
Automated Laser Sighting and Flux Dispensing
Fast Production of Densely Populated Mixed Technology Assemblies
Fast Placement Machines for Ultra-Small and Ultra-Thin Chip Components
Automated Aqueous Cleaning at Multiple Stages of Production
Wave and Soldering Machines
Chassis Wiring and Assembly
At JHYPCB, we use various best-in-class equipment. This helps us provide performance oriented and high-quality PCBs. We believe the following equipment have helped us establish our footprint as one of the leading double sided SMT and mixed technology services in China.
Testing and Inspection Procedures
Acoustics Scanning Microscopes
Automatic Dispensing Machines
Stencil Printing Machines
We follow rigorous testing and inspection procedures, which allow us to ensure high accuracy of circuit boards:
We ensure that a PCB meets UL safety standards. We follow all the required industry standards such as:
Automated Optical Inspection: Our AOI equipment provides comprehensive fault coverage. It helps us to inspect components thoroughly for their optical placement, orientation, value, color differences, short circuits, dry joints, etc. This is the most effective way of inspecting all mixed technology PCBs, as well as SMT, Through-Hole, and BGA assemblies.
X-Ray Testing: We employ a state-of-the art automated X-ray system to ensure highest quality inspection of PCBs. This type of testing helps us to inspect the quality of PCB components and any hidden faults that are otherwise invisible during visual inspection. This type of testing helps us remove any manufacturing defects in the preliminary stages, and avoid various expensive performance problems in the long run.
Functional Testing: This is performed to ensure the proper functioning of the PCB assembly.
Applications of Mixed Technology PCB Assembly
All assemblies built to IPC-A-610-D & ANSI/J-STD-001
The printed circuit boards that are manufactured using mixed technology are used in a wide range of applications and products. Here are some major and most common applications of the mixed technology PCB assemblies:
How is a PCB with Mixed Lead Components Assembled?
LED Lighting Products
Industrial Controller Assemblies
Long ago, before the Printed Circuit Board was invented, the original soldering technique consisted of hand soldering individual components using a soldering iron. That method took a lot of time to make all those connections, and produced connections that were only as consistent as the person wielding the iron.
Nowadays, using Printed Circuit Boards, wave soldering and reflow soldering is consistent from one connection to the next, and from one board to the next, making reliable and consistent electronic circuits.
PCBs With Surface-Mount Devices
Printed circuit boards (PCBs) with surface-mount devices (SMDs) can be wave or reflow soldered, while PCBs with pin-through-the-hole devices (PTHs) can only be wave soldered. PCBs with a mixture of SMDs and PTHs require both wave and reflow soldering, and have to be soldered in several steps.
Reflow soldering requires a screen process. In the screen printing process, a paste containing both solder and flux is administered to the PCB solder pads.
In the next step, making sure the surface-mount-devices will have their leads in the paste, a machine places them on the PDB
A paste, containing both solder and flux, is applied to the solder pads of the printed circuit board. The components are then placed on the PDB and the paste holds the components in place.
To solder the components to the board, a stream of hot air or radiant heat is applied to the whole board. This evenly heats up the board, the components, and the solder paste, melting the solder in the paste and connecting the components to the board.
When all the components are placed on the PCB, heat in the form of infra-red radiant heat or hot air is used to melt the paste, which reflows to make permanent connections.
Instead of heating a paste, a solder wave can connect the Surface Mount Devices to the PCBA. However, so the Surface Mounted Devices don't fall off the PCBA as it's turned over, and the solder wave knocks off any that haven't already fallen off, the components require gluing.
PTH components cannot be reflow soldered, but require wave soldering after their leads are inserted through the holes in the PCB.
The wave of solder is produced with a pump, so that a welling up of solder will touch the PCB as it is passed over the solder-pot. All exposed metal on the bottom of the PCB will be coated with the solder.
PCBs With Both PTH and SMD Components
If PTH and SMD components are used on the PCB, more steps are required to attach them:
1. Component side SMDs are reflow soldered
Solder paste is only applied to the pads that receive components, so the other pads will remain clean for the next steps. The Surface-Mount-Devices going on the component side are placed on the PCB and the solder paste and then reflow soldered.
2. Solder side SMDs are glued in place on the solder side of the PCB.
3. Pin-Through-Hole devices are machine inserted into the holes on the PCBA
4. Hand installed devices are installed on the PCBA
The Surface-Mount-Devices going on the solder side of the PCB are glued in place. The PDB is turned over. The other machine installed devices are insserted with their leads through the holes in the PCB. Any hand inserted devices are then installed.
5. The glued SMDs, PTHs, and the hand installed devices are soldered in one wave
The Surface-Mount-Devices going on the solder side of the PCB are glued in place. The PCB is turned over. The other machine installed devices are inserted with their leads through-the-holes of the PCB, from the component side.
6. Other components that have to be hand soldered to the PCB are then installed
7. The assembly is tested
Printed Circuit Boards Assembly (PCBA) Process
PCB Assembly FAQ
Surface Mount (SMT) Assembly
Through Hole Technology Assembly
BGA PCB Assembly Services
How to Mixed Technology PCB Assembly
How to start to Prototype PCB Assembly
How to Reduce PCB Assembly Cost
Comparison between THT Assembly and SMT Assembly