Communicate with Supplier? Supplier
Megan Ms. Megan
What can I do for you?
Chat Now Contact Supplier

JingHongYi PCB (HK) Co., Limited

Lead Free Surface Finishes

Lead-Free Surface Finishes | PCB manufacturing

These are the lead-free PCB surface finishes we have available for your PCB order.


Gold Finish

Maybe Electrolytic Electroless, or Immersion

- ENIG
(Electroless Nickel Immersion Gold)

2-5 microinches. Purpose: To prevent oxidation, extend shelf life, provide a wire bonding surface (when aluminum wire is used), and used to provide an electrically conductive surface on PCBs. Used for solderability when the flatness of the pad is critical. ENIG has a shelf life longer than 12 months.

- Hard Gold

Purpose: Used for Gold Fingers (minimum 30 microinches), soldering (maximum 17 microinches), to prevent oxidation and extend shelf life.

- Soft Gold

Purpose: Used for wire bonding (Ultrasonic minimum 2 microinches/Thermasonic minimum 30 microinches) and to prevent oxidation and extend shelf life.

Immersion Silver

Use for solderability purposes (2-10 microinches). Used for solderability when the flatness of the pad is critical.

Lead-Free Solder

Use for solderability purposes (2-5 microinches). Used for solderability when the flatness of the pad is not critical.

OSP
Organic Solderability Preservatives)

Used for solderability when the flatness of the pad is critical.

White Tin (Immersion Tin)

Used for solderability when the flatness of the pad is critical.

Related Products List