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JingHongYi PCB (HK) Co., Limited

Blind Buried Hole Multilayer PCB Circuit Board

Blind Buried Hole Multilayer PCB Circuit Board

Payment Type: L/C,T/T,D/P,Paypal,Money Gram,Western Union
Min. Order: 1 Piece/Pieces

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Basic Info

    Structure: Multilayer Rigid PCB

Additional Info

    Packaging: Vaccum Package

    Productivity: 10000

    Brand: JHY PCB

    Transportation: Ocean,Air

    Place of Origin: China

    Certificate: ISO9001

Product Description

Blind Buried Hole Multilayer PCB Circuit Board

The buried hole is the through-hole between the inner layers. The outer layer cannot be seen. Both the upper and lower sides are inside the board. The middle layer cannot be seen after pressing. So it doesn't take up the area of the outer layer. It is often used in the application of high-end products such as mobile phones, GPS navigation and so on. The structure of the conventional multilayer circuit board includes the inner circuit and outer circuit and then uses the process of drilling and hole metallization to realize the connection function between the inner circuits of each layer. With the development of electronic products to high density and high precision, the same requirements are put forward for the circuit board.

Blind hole: compared with through-hole, through-hole refers to the hole drilled through all layers, while blind hole refers to none drilled through-hole; in short, one side can be seen on the surface of a blind hole, but the other side is in the board, so we can't see it. For example, we usually grow vegetables, stems, leaves, and flowers on the soil, but the roots are in the soil, we can't see.

In general, there are PCBs on mobile phones or navigation instruments that combine blind hole and buried hole technology. Such boards require high technical content and accurate accuracy. Therefore, the requirements for factory machinery and equipment are much higher than those for ordinary multilayer boards, and the cost of corresponding circuit boards is also higher than that for ordinary multilayer boards. The so-called "one penny for each shipment" is just to say That's the reason. With high technology, the price will go up naturally.

Precautions in the process of making blind buried hole multilayer Printed Circuit Board

1. The overlap between layers in the manufacture of multilayer printed circuit board with blind buried holes

By using the pin front positioning system of ordinary Multilayer PCB production, the graphics of each layer and single-chip are made into one positioning system, which creates the conditions for the success of manufacturing. As for the ultra-thick single piece used in this time, if the plate thickness reaches 2 mm, the method of milling a certain thickness layer at the location of the positioning hole can also be attributed to the processing capacity of the punching four slot positioning hole equipment of the front positioning system.

2. The problem of glue flow on the board after lamination

In view of the characteristics of the manufacture of blind buried multilayer Printed Circuit Boards , sometimes it is inevitable that there will be glue flow on both sides of the laminated boards. In order to ensure that the subsequent process can be carried out normally, it is necessary to remove the glue flow on the board surface manually. This process is difficult and inconvenient for the operator. For this reason, we choose two kinds of materials as release and isolation materials, one is polyester film currently used, the other is polytetrafluoroethylene film. The results show that the flow of adhesive on the laminate with polytetrafluoroethylene film as release isolation material is better than that with polyester film as release isolation material.

3. Position accuracy and the coincidence of graphic transfer

In the manufacturing process of blind buried hole multilayer printed circuit board, we use a silver salt plate template to make the inner layer pattern and transfer the pattern through the four slot positioning hole which is consistent with the single positioning hole punching. In view of the NC drilling and hole metallization of each inner layer plate before the inner layer graphics transfer, there is a problem of four slot positioning hole protection. In addition, after lamination, the following methods can be used to transfer the outer layer graphics:

A. according to the routine, diazo plate template made by silver salt plate template is used, and the two sides are respectively aligned;
B. use the original silver salt plate template, and make the plate according to the four slot positioning hole;
C. when making the template, two locating holes shall be designed outside the effective area of the figure at the same time of the design of four locating holes. Then, when the outer figure is transferred, the outer figure positioning plate is made through the two positioning holes.

4. Resin filling of the semi-cured sheet with through-hole and the blind hole in lamination

According to the design requirements, the through-hole naturally needs to be filled with semi curing resin. The filling effect will directly affect the quality and reliability of the finished board. For the blind hole fabrication on both sides, some designs need to avoid the resin of the semi-cured sheet entering into the hole as much as possible, while others need to use the fluidity of the resin of the semi-cured sheet to fill it flat. Therefore, we need to deal with specific problems. It is difficult to realize the blind hole without resin in the hole.

Difference between multilayer circuit board and gold-plated PCB

The blind buried hole multilayer circuit board and gold-plated PCB are the common technology in the production of circuit boards nowadays. With the increasing integration of the IC, the IC pin is more and more dense. However, it is difficult for the vertical tin spray process to blow the solder pad flat, which brings a difficulty to SMT mounting; in addition, the shelf life of the tin spray plate is very short. However, these problems are solved by the blind buried multilayer circuit board. For the surface mounting process, especially for the ultra-small surface mounting requirements, the flatness of the solder pad is directly related to the quality of the solder paste printing process.

The quality of reflow soldering is greatly influenced by the multilayer PCB with blind hole. Therefore, the gold plating of the whole PCB is often seen in the process of high density and subminiature surface mounting. In the trial production stage, the influence of component purchase and other factors is not that the blind hole multilayer circuit board is welded immediately, but it often needs to wait for weeks or even months to use. The shelf life of gold-plated PCB is many times longer than that of tin spray process PCB. So everyone is willing to adopt it. Moreover, the cost of the blind buried multi-layer PCB in the prototype manufacturing phase is almost the same as that of the lead-tin alloy PCB.

Product & Service

4 Layer PCB Immersion Gold fabrication4 Layer PCB Immersion Gold manufacturing

Why choose us?

  • Save money&time! Achieve peace of mind!
  • A professional and trustworthy PCB Prototype manufacturer.
  • Fastest PCB Prototype.
  • One stop solution for various PCB & SMT Stencil .
  • Low cost for simple PCB.
  • Affordable price for high-tech PCB.
  • Minimum orders 1pcs.
  • 24-hour online customer service.
  • Professional PCB engineer for one-to-one service.
  • Shipment on time.
  • Guarantee good service and quality from PCB quotation to delivery.

Certification(UL:E466618, TS16949, ISO9001.RoHS)

Quality is one of the cornerstones in Global Success' business. We work actively with continuously improvements to secure a high quality level on our products as well as our services. To satisfy our customers we focus on producing PCB with stable top quality. We have implemented the UL:E466618, TS16949, ISO9001.RoHS quality system. The perfect quality assurance system and with various inspection equipment`s help us to monitor the whole production process, assure stability of this process and high product quality, meanwhile, advanced instruments and technology methods have been introduced to attain sustained improvement.

Certification Name: UL
Certification Name: TS16949
Certification Name: SGS

PCB Shipment

JHY PCB offers flexible shipping methods for our customers, you may choose from one of the methods below.


Shipping Process
After production and testing, your PCB orders will be sent to our shipping department. As the quick turn PCB Manufacturer, JHY PCB shipping department will ship your PCB quickly without any pending.

JHY PCB 's Packing Way

  • Use one professional PCB vacuum bag, with desiccant inside. Vacuum compressed totally.
  • Paste label and RoHs mark. Use second vacuum bag to protect boards again, vacuum compressed, make sure no exception.
  • Microsection report and Tin testing board are put together with PCB in cartons.COC (Certificate of Conformity) will be sent to customer by email in PDF.
  • Several layers of thick EPE(Expandable polyethylene) are filled fully in gaps between PCBs and cartons. The thickness of 1 layer EPE is 10mm.
  • Neutral Packing is adopted if no special requirements. Strong and thick cartons(Thickness:10mm,7 layers). Different sizes of cartons are designed to meet demand of different PCB size. All package are within weight limit of cartons. For mass production order, no exceed 21kg per carton normally.
  • All cartons sealed with strong adhesive tape should be sealed twice so as to make them more durable.
  • Solid PP/PET strapping is used outside of cartons.
  • Shipping mark, fragile mark and postcode label are all pasted clearly.
Whatever we do or whatever we think of is to make sure boards are shipped to customer safely and quickly.

How to ship your PCB?

  • Firstly, JHY PCB shipping department will print order address and invoice.
  • Secondly, JHY PCB will set the shipment information on the Logistics company website.
  • Thirdly, the Logistics company staff will collect the package from JHY PCB and ship it to you.

Shipment Term

With the purpose of better customer service and meeting the customer demand, JHY PCB provides following shipping methods.
JHY PCB is experienced in exporting. For PCB Prototype and small-medium volume PCB order, we have a stable and long-term good relationship with forwarder, such as international express company DHL, FedEx, TNT, UPS. For mass production order, we have a famous and reliable shipping company for support.

Looking for ideal Blind Buried Hole Multilayer PCB Manufacturer & supplier ? We have a wide selection at great prices to help you get creative. All the Blind Buried Hole PCB are quality guaranteed. We are China Origin Factory of Blind Buried Hole Circuit Board. If you have any question, please feel free to contact us.

Product Categories : Multilayer PCB > 4 Layer PCB

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